Manufacturing Process of Ceramic PCBs, Substrates

BHOSCH Electronics Applied Technology (BEAT) has established state-of-the-art facilities for the manufacturing of ceramic substrate PCBs and a wide range of electronic packaging solutions.

We support low- medium and high-volume production of ceramic PCBs, die assembly, wire bonding, metal packaging, and epoxy encapsulation. Custom ceramic PCBs and package designs can be developed to meet specific customer requirements.

BEAT is founded and managed by industry experts in electronic packaging with over 30 years of experience.