About Us
One stop solution for semiconductor die packaging /encapsulation proto types to mass production
All critical technologies are available under one roof-
Experts in the field of semiconductor die pacaking having more than 30 years of experience
Cost effective solutions for you need in semiconductor assembly and integration
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Our Infrastructure at BEAT
BEAT has setup state of art manufacturing facilities with :
RCC Building of 20000 Sq Feet
Full plant having centralised air-conditioning
Full plant having centralised air-conditioning
Reliable and clean power sources to support sensitive and high-demand equipment is provided through UPS and genset backup.
Water Purification Systems is installed for the production of ultra-pure water used in various processes.
Supply of gases like nitrogen, argon, and compressed air for processes and environmental control are provide through well-structured lines.
Facilities and Equipment at BEAT
| CAD Centre for Design | Ultra-low Vacuum Ovens |
| Laser Photoplotter | Vacuum Brazing Furnaces |
| SS Mesh Stretcher | High Temperature Sintering Furnace |
| Screen Exposer | VMC and CNC Machines |
| Stencil and Screen Printer | Mechanical Presses |
| Laser CNC Routing and Drilling | Sand Blasting Machine |
| Laser Marking | Surface Plates |
| Precise Screen and Stencil Printer | Powder Compacting Press |
| Curing Ovens | Electro Cleaning Path |
| High Temperature Belt Furnaces | Nickel Plating |
| Resistor Laser Trimming | Gold Plating |
| Magnetron Sputtering Machines | Copper Plating |
| Spin Coaters | Auto Die Bonder |
| Mask Aligner | Auto Wire Bonder |
| Plasma Cleaning Machine | Auto Bond Pull Tester |
| Chemical and Dry Etching Systems | Semiauto Wire Bonders |
| Ultrasonic Cleaning Machines | Laser Welding Machines |
| XRF Analyser | Helium Leak Detector |