bhoschelectronics

Hermetic Metal Packages

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High Frequency Oscillator (HFO)

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2pin, 3pin and 4pin GTMS With Package

Hermetic Metal Packages

We are Manufacturer, Supplier, Exporter ofHermetic Metal Packages, Thick Film Printed Ceramic Substrates, Direct Bonded Copper Substrates, Microelectronics Assembly / Assemblies, Low Temperature Co-Fire Ceramics LTCC Substrates, Thin Film Sputtered And Patterned Ceramic Substrates, Electrical Testing Jigs, Electrical Functional Testing Services, Environmental Testing Services, Screening Testing Services from Pune, Maharashtra, India.

Hermetic packaging is a requirement for all applications where electronic components must be protected from corrosive environments to ensure acceptable service life. Extremely high reliability is required for space electronics, often utilising hermetic packages. Metal packages with glass to metal seals are the common solution for low to medium power levels.

There are mainly two types of glass to metal seals , one is matched seal and other one is compression seal.

A "matched glass-to-metal seal" uses glass and metal materials with similar coefficients of thermal expansion (CTE), creating a bond through chemical reaction, while a "compression glass-to-metal seal" relies on a large difference in CTE between the glass and metal, where the metal housing shrinks onto the glass during cooling, creating a tight seal through compressive force; essentially, a matched seal bonds the materials together, while a compression seal physically squeezes the glass with the metal to seal it.

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KOVAR Package Machined - GTMS and Plated

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8QK Switch for URSC

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2QK Switch for URSC

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Nickel Electroplated Kovar-packages for Military Applications

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Compressive and Matched Sealing done on Stainless Steel

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GTMS for Planar Packages

Glass to metal Seal Capabilities

Other type of materials for package body where package base of high thermal conductivity materials brazing with
frame of suitable materials for glass sealing can be provided as per customer need.

We have capabilities and facilities right from Package design, machining of packages, seal formation, plating
(Nickel and Gold), and lot qualification test to meet the requirements as per standard and specified by customer.


  • Hermeticity: ≤ATM 1×10-8 cc/sec HE.
  • Manufacturing standard complies with MIL-883/MIL-PRF-38354, and JEDEC-9C.
  • Standard testing: insulation resistance tests, pin pulling tests, etc.
Package Body Material Pins Material Type of Seal
Kovar Kovar Matched Seal
Cold Rolled Steel Alloy 52 Compression Seal