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Thick Film Printed Ceramic Substrates
Thin Film Sputtered And Patterned Ceramic Substrates
Direct Bonded Copper (DBC) Substrates
Low Temperature Co-Fire Ceramics (LTCC) Substrates
Hermetic Metal Packages
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Thick film Printed Ceramic Substrates (HMC)
Thin-Film Sputtered and Assembled Circuit
Assembled Thin-Film Sputtered PFT
SiChromeTitanium and Copper Sputtered Substrate for Defense Application
Nickel and Gold Electroplated Package for Space Applications
High Frequency Oscillator - (HFO)
4-Pin Feedthroughs
Kovar Package Machined – GTMS and Nickel + Gold Electroplated
8QK Switch for URSC
2QK Switch for URSC
Nickel and Selective Gold Planar Kovar Packages and Lids for Military Applications
Compressive and Matched Sealing Done on Stainless Steel
GTMS for Planar and Non-Planar Packages
PCB Assembly
DAU II Board of VSSC
Thermovac Test Setup
Thermal Cycle Chamber
Bump Testing Machine
Mechanical Shock Machine
Vibration
Burn-In Test Chamber
Low Temperature Co-Fire Ceramics LTCC Substrates
Hermetic Metal Packages
Hermetic Metal Packages
Thin film sputtered and patterned Ceramic Substrates
TO Packages GTMS and Packaging
Packaged TO741 ICs
Hermetic Metal Packages
Various Metal Packages For Space Applications
Assembled and Sealed Thin Film PFT Circuits
Hermetic Metal Packages
LTCC Green State Substrate
