Thin Film Substrates are used in microelectronics products are fabricated on ceramic or insulated substrates by depositing materials in thin layers less than 1 micron. These layers can be conductive, resistive depending on applications. These metallized substrates are then patterned to form microcircuits using masking, etching and plating processes. The advantages of thin film technology are that better resolution and densities can be achieved. These substrates are used in specific applications and RF applications.
There are multiple methods for deposition of material on the ceramic substrate. DC or Direct Current or RF Sputtering is a Thin Film Physical Vapour Deposition (PVD) Coating technique where a target material to be used as the coating is bombarded with ionized gas molecules causing atoms to be “Sputtered” off into the plasma. These vaporized atoms are then deposited when they condense as a thin film on the substrate to be coated. Sputtering of two or three layers as per requirement can be done with sputtering machine. Metallized substrate size 4”x4”is good choice for optimum cost during development and the production of the thin film substrates.