BEAT can guide you to select the packaging technology, design the ceramic PCB layout and package needed for your requirement. We can guide you on the component selections and processes for encapsulation. Our processes are qualified and highly reliable, with fast turnaround.
BEAT is specialized in reverse engineering of legacy and other components. BEAT can generate a schematic from the part itself by deconstructing the part and building a data package: blueprints, schematics, bill of materials.
For customers that require a technical solution to their obsolescence problem, at BEAT we can design a cost-effective solution to create a pin to pin compatible replacement, guaranteed to meet the form, fit and functional specifications of the original part.
BEAT can supply Ceramic PCBs of Thick film, Thin Film, DBC and LTCC. We support for prototypes to mass production.
BEAT provide services right from package design, mechanical fabrication, glass to metal seal and surface finish with nickel and gold plating. Our turnaround time is very minimum for prototypes and mass production. We also provide the lids suitable for laser welding and resistance welding seam sealing package for seam sealing.
Hybrid assembly consists of attaching components onto a screened substrate and sealing the substrate into a package. BEAT provides quick turn-around for prototypes and in-time production and has clean areas of Class 100 for pre-cap inspection and class 10,000 for assembly.
BEAT has both manual and automated wire-bonding and die-attach capabilities. These include ball and wedge bonding, auto die attach and auto dispense for epoxy, encapsulate.
Manual and semi-automatic functional testing to customer spec. Performed multiple times in manufacturing process. All processes comply for MIL-PRF-38534 and certified to as per standards, screened and tested per MIL-STD-883 with selective testing.
BEAT has significant experience testing devices to MIL-883. Our experts have a thorough understanding of military testing standards. These test includes mechanical test such as vibration, mechanical shock, centrifuge, temperature test such as low and high temperature test performance . temperature cycling, thermos vacuum test etc.